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Silicon Part Go Through A Lot Of Processes And Cleaning Steps

The preparation of the Silicon Part begins with the silicon single crystal bar, and the cleaning of the polishing sheet ends so that it can be used in an excellent environment. During the period, from a single crystal silicon rod to the processing of a few pieces of silicon to meet the special requirements to go through a lot of processes and cleaning steps. In addition to many process steps, the whole process is almost always carried out in a clean environment. The processing of the Silicon Part starts from a relatively dirty environment and is finally completed in a 10-level flat room.

All process steps are summarized in three main categories: the ability to modify physical properties such as size, shape, flatness, or the properties of some bulk materials; can reduce the number of undesirable surface damage; or eliminate surface contamination and particles. The order of the process steps is important because the decisions of these steps can cause the Silicon Part to be damaged as little as possible and to reduce the contamination of the Silicon Part.

In the introduction of silicon processing, the first step from the single crystal silicon rod is the slice. The key to this step is how to reduce the loss as much as possible when the monocrystalline silicon rod is processed into silicon Silicon Parts, that is, to require the single crystal rod to be processed as useful as possible. In order to get the best silicon Silicon Parts as possible, the Silicon Parts require a minimum amount of warpage and a minimum amount of ditch loss.

There are two main ways in the slicing process - inner circle cutting and thread cutting. These two forms of cutting are applied because they minimize the loss of material, minimize damage to the Silicon Part, and allow the warpage of the silicon Silicon Part to be minimal.

Slicing is a relatively dirty process that can be described as a grinding process that produces large amounts of particles and a lot of very shallow surface damage.

After the Silicon Part has been cut, the adherent carbon plate and the adhesive used to bond the carbon plate must be removed from the silicon Silicon Part. In this process of cleaning and cleaning, it is important to keep the order of the Silicon Parts because they have not been identified yet.

After the ingot is cut into a piece of silicon, the Silicon Part is marked with a laser. A high-power laser printer is used to mark the surface of the Silicon Part. The Silicon Parts are encoded in the same order from the ingot cutting, so that the correct position of the Silicon Parts can be known. This code should be uniform, used to identify the Silicon Part and know its source. The code can indicate where the Silicon Part is cut from the position of the single crystal bar. It is important to keep this traceability because the overall properties of the single crystal will vary with one end of the ingot to the other. The number must be deep enough to remain in the final Silicon Part after polishing. After encoding on the silicon, even if the silicon is missing, but also can be traced back to the original location, and if the trend is clear, then you can take the correct measures. The laser logo can be on the front of the Silicon Part or on the back, although the front is usually used.

When the slices are completed, the silicon has a sharp edge, you need to chamfer to form a bullet-like smooth edge. The edge of the Silicon Part after the chamfer has a low central stress, thus making it stronger. The strengthening of the edge of the Silicon Part, can make it in the future processing of silicon, reduce the degree of fragmentation of silicon.

The next step is to clear the slicing process and laser marking when the different damage, which is grinding process to be completed. At the time of grinding, the Silicon Parts are placed on the carrier and placed around a number of discs. Both sides of the Silicon Part can be in contact with the disc, so that both sides of the Silicon Part can be ground to the same time. The disc is made of cast iron and has a serrated edge. There are a series of holes on the grinding disc, allowing the grinding sand to be distributed on the Silicon Part and moving with the grinding machine. The grinding plate can remove the serious damage caused by the slices, leaving only some of the equilibrated scars; the second benefit of the grinding piece is that the Silicon Parts are very flat since the grinding discs are extremely flat.

The grinding process is mainly a mechanical process, the disc discs the abrasive sand on the surface of the Silicon Part. The abrasive sand is composed of fine particles formed by delaying the calcination of the alumina solution, which grinds the outer layer of the silicon. The depth of the outer layer to be ground is deeper than the depth of damage caused by the slice.

In the silicon into the resistance before the stability of the need to clean, the organic matter and metal contamination removed, if there is metal residue in the silicon surface, when the resistance to stabilization process, the temperature increases, will enter the silicon body. Here, the cleaning process is to immerse the Silicon Part in a cleaning solution (H2SO4 + H2O2) capable of removing organic matter and oxides. Many metals are dissolved in the chemical cleaning solution in the form of oxides. Then, hydrofluoric acid (HF) The oxide layer on the surface of the Silicon Part is dissolved to remove dirt.


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