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Silicon Part Increase The Removal Rate Of Impurities

With the development of photovoltaic cell and semiconductor technology, the requirement of Silicon Part surface cleanliness is more and more high, it reaches micron level or even nanometer level, which is a great challenge to the present surface cleaning technology of Silicon Part, and it is urgent to optimize and improve the cleaning technology of Silicon Part. In view of the current wet cleaning and dry cleaning technology, can be improved from many aspects, so as to achieve the stringent requirements of surface cleanliness of silicon Silicon Part.

(1) Wet cleaning has a great dependence on chemical reagents, organic matter, oxide layer, particles, metal ions and other impurities require different chemical agents, both increase the process and increase the cost and the resulting waste liquid will cause environmental pollution, simplifying the wet cleaning process, such as RCA cleaning, It can shorten the removal efficiency of impurities by developing new active agents and chelating agents.

(2) It is very important to reduce the surface damage of the Silicon Part by cleaning process. The strong oxidizing and corrosive properties of chemical agents can cause some damage to the surface of silicon Silicon Part while removing impurities, reduce the performance and stability of silicon Silicon Part, and can be developed and improved, for example, on the basis of double stream atomization cleaning process, With the ultrasonic cleaning process, it does not damage the surface of the damaged silicon Silicon Part and improve the removal rate of impurities.

(3) Many silicon Silicon Part cleaning process is limited to the laboratory, because the cost is too high to promote the large area, it is necessary to search for alternative materials on the basis of the original technology and improve the cleaning technology, to achieve the miniaturization of cleaning equipment and one-time completion of Silicon Part cleaning makes it possible.

(4) The cleaning process automation is a large-scale factories and enterprises are very much needed, automated dry washing process in the country is very deficient, in the reduction of dry cleaning costs at the same time to achieve automatic dry cleaning is the development trend of cleaning technology.

(5) The combined cleaning process is the mutual benefit of wet cleaning and dry cleaning, which can reduce the pollution of wet cleaning and improve the cleaning efficiency. I believe that through deep and meticulous research, silicon Silicon Part cleaning technology will have a broader prospect.

Wet cleaning technology is still dominant in the surface cleaning of silicon Silicon Part, but the use of chemical reagents will produce a lot of poisonous waste liquid, which causes environmental pollution. At the same time, the high integration of the device requires that the silicon Silicon Part cleaning to minimize the damage and damage to the surface of the Silicon Part, to minimize the solution itself or the process of contamination, to meet the requirements of submicron devices, which is a great challenge to wet cleaning process.

Dry cleaning technology can be on-line to remove the particles on the Silicon Part, organic contamination, cleaning precision reached the micron level, no damage to the Silicon Part surface, is a good development prospects of cleaning technology. However, due to the lack of technology, the high cost of dry cleaning technology has been restricting the popularization and development of its large area.

The commonly used silicon Silicon Part cleaning technology has wet cleaning and dry cleaning process. Wet cleaning with strong corrosive and oxidizing chemical solvents, such as $literal, $literal, DHF, NH3 $literal and other solvents, silicon Silicon Part surface impurity particles and solvents produced by chemical reaction to produce soluble matter, gas or directly off. In order to improve the removal effect of impurities, we can use the technical means of mega-sound, heating and vacuum to clean the Silicon Part surface and obtain the requirement of cleanliness.

Dry cleaning means that chemical solvents are not used during cleaning, such as gas phase dry cleaning technology and beam cleaning technology. The gas phase dry cleaning technology uses the Gasification anhydrous HF and the silicon Silicon Part surface's natural oxidation layer interaction, may effectively remove the silicon Silicon Part surface oxide and the oxide layer the metal particle, and has the certain inhibition silicon Silicon Part surface oxide film production the effect. The gas phase dry cleaning greatly reduces the amount of HF and speeds up the cleaning efficiency.

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